Camera module

ABSTRACT

A camera module includes a PCB (Printed Circuit Board) installed with an image sensor, a base mounted on the PCB, and a bobbin reciprocatingly mounted above the base. A bottom elastic member is fixed to the base to support the bobbin, and a terminal is installed at the base, one end of which is conductively connected to the PCB and the other end of which is conductively connected to the bottom elastic member at a solder part. A solder cut-off part is formed at the base to cut off movement of overflowing solder from the solder part.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a Continuation Application of U.S. patentapplication Ser. No. 16/899,922, filed Jun. 12, 2020, which is aContinuation Application of U.S. patent application Ser. No. 16/241,297,filed Jan. 7, 2019 (now U.S. Pat. No. 10,721,383), which is aContinuation Application of U.S. patent application Ser. No. 15/413,610filed Jan. 24, 2017 (now U.S. Pat. No. 10,212,323), which is aContinuation Application of Ser. No. 15/175,703 filed Jun. 7, 2016 (nowU.S. Pat. No. 9,591,196), which is a Continuation Application of U.S.application Ser. No. 14/531,178, filed Nov. 3, 2014 (now U.S. Pat. No.9,380,193), which claims priority under 35 U.S.C. § 119 to KoreanApplication Nos. 10-2013-0133676 and 10-2013-0133690, each filed on Nov.5, 2013, whose entire disclosures are hereby incorporated by reference.

BACKGROUND 1. Field

Exemplary aspects of the present disclosure relate to a camera module.

2. Background

A camera module can perform an auto focusing function by arranging alens barrel mounted with a plurality of lenses at an upper surface of aPCB (Printed Circuit Board) installed with an image sensor and by movingthe lens barrel or at least one sheet of lens relative to the imagesensor. The auto focusing function may be implemented by variousactuators, where an auto focusing method using a VCM (Voice Coil Motor)is generally employed.

In the VCM, a magnet is mounted at a holder member, which is fixedlymounted at an upper surface of the PCB. A bobbin is vertically andreciprocatingly arranged at a position opposite to that of the magnet,where the bobbin is wound with a coil at a periphery. The bobbin ismounted at an inner surface with a lens barrel having a plurality oflenses. The coil is electrically connected to the PCB, and to this end,a terminal of conductive material is soldered to a metal-materialedelastic member to elastically support the bobbin.

When the terminal is soldered to a bottom elastic member as noted above,the terminal and the bottom spring are applied to a structure formedwith mutually different members, where a soldered position correspondsto a contact surface between an upper surface of the bottom spring and aterminal boss of terminal so formed as to contact the bottom spring.

The contact surface between the terminal and the bottom spring is soformed as to allow a maximum electrical connection. However, theredisadvantageously occurs a problem of solder overflow depending onworkmanship, because the soldering process is manually done.Particularly, due to miniaturization of mobile devices, the size ofcamera module is decreased to result in generation of frequent solderingdefects, from which bad assembly or erroneous operation is caused.

Furthermore, an empty space is generated as large as thickness of thebottom elastic member, through which foreign objects may be introducedinto a camera module.

Meanwhile, the bobbin performs an auto focusing function whilereciprocating in parallel with an axial direction. At this time, thebobbin reciprocates in repetitive contact with a base, whereby thebobbin or the base may be damaged through the repetitive contact. Inorder to avoid this problem, a plurality of bosses is separately formedat a surface opposite to the base of the bobbin to allow a floor surfaceof the boss to surface-contact the base.

Furthermore, the base is mounted with an IR (Infrared) cut-off filter ata position opposite to the image sensor, where the bobbin frequentlycontacts the base at a position near to a contact surface of the IRcut-off filter. Thus, there is a need to reduce the size of the boss, sothat interference with the IR cut-off filter can be prevented. As aresult, the boss may be frequently damaged by repetitive use or externalshock.

When the boss is damaged, foreign objects generated therefrom canpollute the IR cut-off filter arranged at a position near to the boss,and when the IR cut-off filter is polluted by the foreign objects, apale round image or a black spot is generated on the image of the cameramodule, resulting in generation of bad camera module.

BRIEF DESCRIPTION OF THE DRAWINGS

The embodiments will be described in detail with reference to thefollowing drawings in which like reference numerals refer to likeelements wherein:

FIG. 1 is a schematic cross-sectional view illustrating a camera moduleaccording to the present disclosure.

FIG. 2 is a plane view illustrating connectivity between a bottomelastic member and a terminal of FIG. 1 .

FIG. 3 is a perspective view illustrating connectivity between a bottomelastic member formed with a solder cut-off part and a terminalaccording to a first exemplary embodiment of the present disclosure.

FIG. 4 is a perspective view illustrating connectivity between a bottomelastic member formed with a solder cut-off part and a terminalaccording to a second exemplary embodiment of the present disclosure.

FIG. 5 is a perspective view illustrating connectivity between a bottomelastic member formed with a solder cut-off part and a terminalaccording to a third exemplary embodiment of the present disclosure.

FIG. 6 is a perspective view illustrating connectivity between a bottomelastic member formed with a solder cut-off part and a terminalaccording to a fourth exemplary embodiment of the present disclosure.

FIG. 7 is a perspective view illustrating connectivity between a bottomelastic member formed with a solder cut-off part and a terminalaccording to a fifth exemplary embodiment of the present disclosure.

FIG. 8 is a perspective view illustrating connectivity between a bottomelastic member formed with a solder cut-off part and a terminalaccording to a sixth exemplary embodiment of the present disclosure.

FIG. 9 is a cross-sectional view enlarging ‘B’ part of FIG. 1 .

FIG. 10 is a perspective view illustrating a floor surface of a bobbinof FIG. 1 seen from a lower side.

FIG. 11 is a perspective view enlarging ‘C’ part of FIG. 1 .

FIG. 12 is a plane view illustrating a floor surface of a bobbin of FIG.1 seen from a lower side.

DETAILED DESCRIPTION

Referring to FIGS. 1 and 2 , a camera module according to an exemplaryembodiment of the present disclosure may include a PCB (Printed CircuitBoard, 10), a base (20), a bobbin (30) and a cover (40). The PCB (10) isinstalled at an upper side with an image sensor (11), and the PCB (10)is mounted at an upper side with the base (20).

An IR (Infrared) cut-off filter (22) may be installed at a positionopposite to the image sensor (11) to prevent a light of infraredwavelength from being transferred to the image sensor (11). In order toprotect the image sensor (11), a sensor holder may be additionallydisposed between the PCB (10) and the base (20). The sensor holder maybe a tube-shaped member enclosing a periphery of the image sensor (11).The sensor holder may be formed integrally with the base (20). The base(20) may be installed with a terminal (21), where one end of theterminal (21) may be conductively connected to the PCB (10) and theother end of the terminal (21) may be conductively connected to a bottomelastic member (35) via soldering.

The terminal (21) may be variably configured depending on design with aconductive material like a metal. The terminal (21) may be formed bybending a member at least twice and coupling the bent member to the base(20). The terminal (21) may be insert-injection molded into the base,for example. The exemplary embodiment of the present disclosure hasillustrated the terminal (21) that is coupled by forming a memberseparate from the base (20).

FIGS. 2 and 3 are views illustrating connectivity between a bottomelastic member (35) and a terminal (21) according to a first exemplaryembodiment to the present disclosure. One end of the terminal (21) maybe formed at a part, where the terminal (21) and the bottom elasticmember (35) are electrically connected, with a terminal end part (21 a)that passes through the bottom elastic member (35) from a lower side toan upper side. The bottom elastic member (35) may be formed at a partadjacent to the terminal end part (21 a) with a terminal connection part(36) configured to at least partially enclose a surrounding of theterminal end part (21 a).

The terminal end part (21 a) may be integrally formed in one body withthe terminal (21) and may be formed by bending one end of the terminal(21). The terminal connection part (36) may be a part of the bottomelastic member (35) and take a shape of a branch by cutting a part ofthe bottom elastic member (35) while the cut part accommodates theterminal end part (21 a) like a slot. The terminal connection part (36)of the bottom elastic member (35) may make the cut part take a shape ofa hole, instead of a slot by expanding to enclose the terminal end part(21 a).

The terminal end part (21 a) and the terminal connection part (36) areconductively connected at the solder part (S) via soldering and maytransfer an electric power supplied from the PCB (10) to a coil (32)through the bottom elastic member (35). The solder part (S) may beformed at a contact position between an upper surface of the terminalconnection part (36) of the bottom elastic member (35) lifted on anupper surface of the base (20) and the terminal end part (21 a). Asolder coated on the soldering part (S) is preferred not to spread on aspace other than the solder part (S) and a surface of the bottom elasticmember (35).

However, the solder may overflow to a section other than the solder part(S) due to operator failure during the soldering operation as the cameramodule is miniaturized. The exemplary embodiment of the presentdisclosure teaches the solder cut-off part formed on the base (20) inorder to minimize the overflow of solders, the details of which will bedescribed later.

The bobbin (30) may be vertically movably mounted at an upper side ofthe base (20). An initial position of the bobbin (30) may be any one ofan upper surface of the base (20) and a space between the base (20) andthe cover member (40). The bobbin (30) may be protrusively formed at afloor surface with a boss (31). The boss (31) may surface-contact thebase (20). The boss (31) will be described in detail later.

The bobbin (30) may be wound at a periphery with a coil (32), and when acurrent flows in the coil (32), the bobbin (30) may perform areciprocating movement to ‘A’ arrow direction of FIG. 1 in response toelectromagnetic interaction with a magnet (41) mounted on the covermember (40).

The bobbin (30) may be formed at an inner circumferential surface with ascrew thread to which a lens barrel (33) mounted with more than one lens(34) is threaded on. However, the coupling between the lens barrel (33)and the bobbin (30) is not limited only to the screw combination, butmay be integrally formed free from screws, or a thread-less lens barrelis coupled to the bobbin using an adhesive.

Referring to FIG. 1 , the cover member (40) may be arranged at an uppersurface of the base (20), and the cover member (40) may be formed at aninner circumferential surface with a magnet (41) to face the coil (32).The cover member (40) may be formed at an outermost surface of thecamera module as illustrated in FIG. 1 , but the present disclosure isnot limited thereto. It is possible to arrange a separate housing memberto wrap an external side of the cover member (40), if necessary.Furthermore, the cover member (40) may be formed with a metal material,and may serve the function of a yoke.

The camera module according to the present disclosure may be arrangedwith an upper elastic member (not shown) and a bottom elastic member(35) to elastically support the reciprocating operation of the bobbin(30). The upper elastic member and the bottom elastic member (35) may beconnected at one end to the cover member (40) or the base and connectedat the other end to an upper end and a bottom end of the bobbin (30).The bottom elastic member (35) may be integrally formed with a terminalsupplying an electric power to the coil (32) wound on the bobbin (30) bybending the bottom elastic member.

A spacer may be interposed between the cover member (40) and the bottomelastic member. The spacer is installed to insulate the bottom elasticmember from the cover member (40), and it is possible to replace thefunction of spacer by changing a shape of the base (20). Furthermore,the camera module may further include a housing member such as a shieldcan configured to wrap the cover member (40) comprising of the externalshape of the camera module.

At this time, the housing member may be centrally arranged with a lenshole with a size corresponding to that of the lens to allow an outsideimage to be transferred to the image sensor through a lens arranged atan inner side of the bobbin (30), whereby the outside image can betransferred to the image sensor (11) through the lens hole. The housingmember may perform an electromagnetic shielding function by beingprovided with a metal material, but the present disclosure is notlimited thereto, and if necessary, the outermost side of the cameramodule may be formed with a resin material, or with other metalmaterials.

Furthermore, the housing member and the yoke may be integrally formedfree from a separate housing member. In other words, instead of formingthe housing member to wrap the yoke for reduction of size of the cameramuddle, the yoke and the housing member may be integrally formed.

As illustrated in FIG. 1 , the camera module according the firstexemplary embodiment of the present disclosure may be installed with asolder cut-off wall as a solder cut-off part for preventing solders ofthe solder part (S) configured to electrically connect the terminal endpart (21 a) of the terminal (21) to the terminal connection part (36)from overflowing.

Referring to FIGS. 2 and 3 , the solder cut-off wall (100) may beprotrusively formed to an upward direction at a position correspondingto that of an opening of the terminal connection part (36) formed bycutting the bottom elastic member (35) to at least enclose the terminalend part (21 a). Even if a larger quantity of solder than desired amountof the solder part (S) illustrated in FIGS. 2 and 3 profusely overflows,the overflowing solder may be prevented from spreading near to a body ofthe bottom elastic member (35) by the solder cut-off wall (100). Foreignobjects generated by the solder pollution can be prevented frompolluting the IR cut-off filter (22) and/or the image sensor (11) sideof the camera module. The solder cut-off part may be formed in variousshapes in addition to a single wall type solder cut-off part.

For example, the solder cut-off part, as that of the second exemplaryembodiment of the present disclosure illustrated in FIG. 4 , may beformed in a shape of a multiple cut-off wall (200). The multiple cut-offwall (200) may include a first cut-off wall (210) formed at a positioncorresponding to that of an opening of the terminal connection part (36)of the bottom elastic member (35), and a second cut-off wall (220)formed in parallel with the terminal connection part (36) and shorterthan the terminal connection part (36).

The first cut-off wall (210) may perform the function of the soldercut-off wall according to the first exemplary embodiment of the presentdisclosure, and the second cut-off wall (220) may prevent the over-flownsolder from over-flowing to a lateral wall side of the base (20) byforming a concave accommodation part along with the first cut-off wall(210). The first and second cut-off walls (220, 220) may be integrallyformed with the base 20.

The solder cut-off part may be formed with a dual cut-off wall (300) asFIG. 5 . The dual cut-off wall (300) may include includes a primarycut-off wall (310) and a secondary cut-off wall (320). The primarycut-off wall (310) is arranged at a position corresponding to that ofthe opening of the terminal connection part (36) of the bottom elasticmember (35) and protruded upward from a part adjacent to the solder part(S) at a first height. A secondary cut-off wall (320) protrudes from theprimary cut-off wall at a second height lower than the first height. Theprimary cut-off wall (310) and the secondary cut-off wall (320) may beprovided in a staircase or stepped shape as illustrated.

The first height may have a value larger than a thickness of the bottomelastic member (35). The rationale is that a relatively large quantityof solder can be prevented from over-flowing compared with the secondarycut-off wall (320), because the primary cut-off wall (310) is arrangednear to the solder part (S). Furthermore, the secondary cut-off wall(320) may be formed with a thickness corresponding to that of the bottomelastic member (35).

The solder cut-off part according to the fourth exemplary embodiment asillustrated in FIG. 6 may be formed with a solder cut-off trap (400),which is a concave groove having a predetermined depth (d). Although theshape of the concave groove may have a same width and length as thesolder cut-off wall (100) protrusively formed at a predetermined heightaccording to the first exemplary embodiment, there is a difference inthat the groove is formed in a concaved groove shape. The depth (d) maybe formed not exceeding the thickness of the base (20). According to theforegoing configuration, the excess solder is prevented from spreadingto a surrounding of the bottom elastic member (35), because the excesssolder from the solder part (S) flows into the concave inner space ofthe solder cut-off trap (400).

The solder cut-off part according to the fifth exemplary embodiment ofthe present disclosure as illustrated in FIG. 7 may be provided with amultiple solder cut-off trap (500) which is formed by a series of singletraps (510, 520), and may be formed with a concave groove as illustratedin FIG. 4 . Although the shape of the concave groove may correspond tothat of the multiple cut-off wall (200) according to the secondexemplary embodiment, there is a difference in that the groove is formedin a concaved groove shape. The difference from the fourth exemplaryembodiment is that an inner space is formed in which the over-flownsolder can move, such that the excess solder can be maximally preventedfrom being protruded upward of the solder cut-off trap (500).

The multiple solder cut-off trap (500) may include a first trap (510)corresponding to an opening of the terminal connection part (36) of thebottom elastic member (35), and a second trap (520) configured inparallel with the terminal connection part (36) and shorter than theterminal connection part (36). The first trap (510) may perform thefunction of the solder cut-off trap (400) according to the fourthexemplary embodiment, and the second trap (520) may form a concaveaccommodation part along with the first trap (510) to provide a space inwhich the excess solder can accumulate.

The solder cut-off part according to the sixth exemplary embodiment ofthe present disclosure illustrated in FIG. 8 illustrates a partialsolder cut-off trap (600). The difference is that, unlike the fourthexemplary embodiment, a position of the partial solder cut-off trap(600) is spaced apart from the periphery of the base (20) at apredetermined distance (g) not to form an opening to a periphery side ofthe base (20), whereby the over-flown solder is prevented fromoverflowing to a periphery side of the base (20).

Meantime, when a solder cut-off part is formed in a concaved grooveshape as in the fourth to sixth exemplary embodiments, there may be amunwanted possibility of the foreign objects being introduced into thecamera module through the concave groove part. Albeit not beingillustrated, in case of the fourth to sixth exemplary embodiments,assembly may be performed by forming a protruding structurecorresponding to that of the solder cut-off part at an assemblycounterpart coupled to upward of the base (20).

For example, as illustrated in FIG. 1 , introduction of foreign objectsmay be prevented by forming, at a position corresponding to that of thesolder cut-off part of the cover member (40) assembled at an uppersurface of the base (20), a protruding rib corresponding in shape to theabovementioned solder cut-off trap (400), the multiple solder cut-offtrap (500) or a partial solder cut-off trap (600).

When the solder cut-off part is formed at the base (20) according to thefirst to sixth exemplary embodiments, the over-flow of solder from thesolder part (S) can be interrupted to prevent the bottom elastic member(35) from being polluted by the excess solder.

FIG. 9 is a cross-sectional view enlarging ‘B’ part of FIG. 1 , FIG. 10is a perspective view illustrating a floor surface of a bobbin of FIG. 1seen from a lower side, FIG. 11 is a perspective view enlarging ‘C’ partof FIG. 1 , and FIG. 12 is a plane view illustrating a floor surface ofa bobbin of FIG. 1 seen from a lower side.

A boss (31) may be formed at a surface opposite to a bottom surface ofthe bobbin (30), that is, at a surface opposite to the base (20). Theboss (31) may take a protruding shape protruded from the bottom surfaceof the bobbin (30), and a bottom surface thereof, that is, a floorsurface, may comprise a flat plane surface to allow surface-contactingthe base (20).

The boss (31) may be formed in any number, as necessary and at any placeas long as the place is a floor surface of the bobbin (30). For example,the boss (31) may be installed at an external side surface of the covermember (40), at a place near to the cover member (40) or at a placefarthest from the cover member (40). The boss (31) may be also formed ata place corresponding to a corner of the cover member (40), and may beformed at places corresponding to four lateral surfaces of the covermember (40).

Furthermore, as illustrated in FIGS. 9 to 11 , an area of a floorsurface (31 b) at the boss (31) may be narrower than a cross-section ofa body of the boss (31), and to this end, a chamfer (31 c) may be formedat a circumference of the floor surface (31 b) of the boss (31).

The bobbin (30) may take an approximate shape of a hollow cylinder andmust have a thin thickness for wall body in order to miniaturize thecamera module. However, the boss (31) receives more shocks and loadsthan other parts because of contact with the base (20). Thus, the boss(31) is required to be formed with a thickness thicker than other partsof the bobbin (30). To this end, the boss (31) is preferred to have adifferent cross-sectional shape than that of a conventional cylindricalwall body.

For example, the boss (31) may take a shape of a surface facing anoptical axis, that is, a plane shape at an inner wall surface (31 a). Asa result, an inner circumferential surface of the bobbin (30) may take ashape alternately formed with a curved section and a plane section. Asillustrated in FIGS. 10 to 12 , the inner wall surface (31 a) of theboss (31) may form a straight section at the inner circumferentialsurface of the bobbin (30) shown in a curved section on a cross-sectionperpendicular to the optical axis. At this time, as illustrated in FIG.12 , an angle (a) formed between an imaginary line (a) connecting acenter of the bobbin (30) to a center of the boss (31) and an imaginaryline (b) connecting a center of the bobbin to a distal end of one sideof the boss may be less than 12 degrees at the inner wall surface (31 a)forming the straight section. The angle (a) according to an optimalexemplary embodiment may be formed not exceeding 11 degrees, and may beformed at 10.16 degrees.

The inner wall (31 a) of the boss may be extended within a so-callednon-screw thread section of the bobbin along an optical axial directionfrom a bottom end of the bobbin (30). Although the non-screw threadsection at an entire inner surface of the bobbin (30) may be reinforcedwith as much as a thickness of the inner wall surface (31 a), it isdifficult to add a reinforcement on all sections for assemble of thelens barrel (33).

By this configuration, it is possible to increase a thickness ofreinforcement of the boss compared with the conventional structure, andthis was confirmed by drop tests that the damage to a floor surface of arelevant boss was restricted.

Meantime, as noted from the foregoing, the configuration of reinforcingthe inner surface of the boss (31) may be possible when a ratio betweena size of external look of the camera module and size of a minordiameter of the bobbin (30) is less than 1.5:1. In other words, when adiameter of the bobbin greater than the size of the VCM is greater, anon-screw thread section may be employed.

An applicability based on ratio of bobbin according to the size of thegenerally well used VCM may be defined by the following table 1.

TABLE 1 (unit: mm) External size of VCM Minor diameter of bobbin ratioremarks 7.5 5 1.50:1 applicable 7.5 5.5 1.36:1 applicable 8.0 5.5 1.45:1applicable 8.0 5 1.60:1 inapplicable

The present disclosure provides a camera module improved in durabilityof boss.

There is provided a camera module, the camera module comprising: a PCB(Printed Circuit Board) installed with an image sensor; a base mountedon the PCB; a bobbin reciprocatingly mounted above the base; a bottomelastic member fixed to the base to support the bobbin; a terminalinstalled at the base, one end of which is conductively connected to thePCB, and the other end of which is conductively connected to the bottomelastic member at a solder part; and a solder cut-off part formed at thebase to cut off movement of overflown solder from the solder part. Thesolder cut-off part may be a solder cut-off wall protruded upward fromthe base. The solder cut-off wall may include first and second cut-offwalls configured to form a concave groove by enclosing the terminal. Thesolder cut-off wall may include a primary cut-off wall protruded upwardfrom the base, and a secondary cut-off wall protruded upward from theprimary cut-off wall.

The solder cut-off part may be a solder cut-off trap formed at apredetermined depth. The solder cut-off trap may be one of a multiplesolder cut-off trapformed by a series of single traps, and a partialsolder cut-off trap spaced apart from an external surface of the base ata predetermined distance.

There is also provided a camera module, the camera module comprising: aPCB (Printed Circuit Board) installed with an image sensor; a basemounted on the PCB; and a bobbin protrusively formed with a boss tocontact the base, wherein an inner wall of the boss is a planeextensively formed within a non-screw thread section of the bobbin alongan optical axial direction.

The inner wall of the bobbin may be alternately formed on across-section perpendicular to an optical axis with a curved section anda straight section. The boss may be so formed as to have an areanarrower at a floor surface contacting the base than that of across-section perpendicular to an optical axis of the boss. The boss maybe formed at a periphery of its floor surface with a chamfer. The bossmay be symmetrically arranged in plural number about the bobbin.

An inner wall of the boss may form a straight section connected to acurved section of the inner surface on a cross-section perpendicular toan optical axis of the bobbin, wherein an angle (a) formed between animaginary line (a) connecting a center of the bobbin to a center of theboss and an imaginary line (b) connecting a center of the bobbin to adistal end of one side of the boss is less than 12 degrees.

The present disclosure has an advantageous effect in that a soldercut-off part configured to prevent overflow of solder is installed at aposition near to a solder part, whereby solder is prevented frompolluting a surface of a bottom elastic member by overflowing at asurrounding of the solder part.

Another advantageous effect is that thickness of boss is reinforced byusing an inner space of a bobbin to improve durability of boss free fromincreased size of bobbin, whereby damage of base can be minimized whenthe base and the boss repetitively collide during auto focusingoperation.

Any reference in this specification to “one embodiment,” “anembodiment,” “example embodiment,” etc., means that a particularfeature, structure, or characteristic described in connection with theembodiment is included in at least one embodiment of the invention. Theappearances of such phrases in various places in the specification arenot necessarily all referring to the same embodiment. Further, when aparticular feature, structure, or characteristic is described inconnection with any embodiment, it is submitted that it is within thepurview of one skilled in the art to affect such feature, structure, orcharacteristic in connection with other ones of the embodiments.

Although embodiments have been described with reference to a number ofillustrative embodiments thereof, it should be understood that numerousother modifications and embodiments can be devised by those skilled inthe art that will fall within the spirit and scope of the principles ofthis disclosure. More particularly, various variations and modificationsare possible in the component parts and/or arrangements of the subjectcombination arrangement within the scope of the disclosure, the drawingsand the appended claims. In addition to variations and modifications inthe component parts and/or arrangements, alternative uses will also beapparent to those skilled in the art.

What is claimed is:
 1. A VCM (Voice Coil Motor), comprising: a base; acover member disposed on the base and comprising an upper plate and alateral plate extending from the upper plate; a bobbin disposed in thecover member; a coil disposed on the bobbin; a magnet disposed betweenthe coil and the lateral plate of the cover member; a lower elasticmember comprising an outer part disposed on an upper surface of thebase, an inner part coupled to the bobbin and a connection partconnecting the outer part and the inner part; and a terminal disposed onthe base, wherein the terminal is electrically connected to the outerpart of the lower elastic member, wherein the base comprises a grooveformed on the upper surface of the base and opened outside, wherein thegroove of the base is disposed at a position corresponding to at least aportion of an end of the outer part of the lower elastic member, whereinthe terminal is connected to the outer part of the lower elastic memberby a conductive member, and wherein the groove of the base is configuredto accommodate at least a portion of the conductive member.
 2. The VCMof claim 1, wherein the terminal comprises a terminal end part moreprotruding than the outer part of the lower elastic member in an upwarddirection.
 3. The VCM of claim 1, wherein the conductive membercomprises a solder.
 4. The VCM of claim 1, wherein the groove of thebase is disposed adjacent to the conductive member.
 5. The VCM of claim3, wherein the groove of the base is configured to accommodate at leasta portion of the solder.
 6. The VCM of claim 1, wherein the outer partof the lower elastic member comprises a terminal connection partsurrounding at least a portion of a periphery of the terminal.
 7. TheVCM of claim 1, wherein the terminal is formed by bent at least twice tobe coupled to the base.
 8. The VCM of claim 1, wherein the terminal endpart is connected to the outer part of the lower elastic member by theconductive member.
 9. The VCM of claim 1, wherein the lower elasticmember and the terminal are electrically connected to the coil.
 10. TheVCM of claim 1, wherein the lower elastic member comprises first andsecond lower elastic members spaced apart from each other, wherein theterminal comprises first and second terminals, wherein the first lowerelastic member connects the first terminal and an end of the coil, andwherein the second lower elastic member connects the second terminal andthe other end of the coil.
 11. The VCM of claim 1, wherein the uppersurface of the base comprises a corner area, and wherein the groove ofthe base is formed on the corner area of the base.
 12. The VCM of claim1, wherein the groove of the base comprises an area overlapped with theouter portion of the lower elastic member in an optical axis direction.13. The VCM of claim 1, wherein at least a portion of the groove of thebase is disposed between the outer part of the lower elastic member andan outer lateral surface of the base.
 14. The VCM of claim 1, whereinthe lower elastic member comprises a hole formed on the outer part ofthe lower elastic member at a position corresponding to the terminal.15. A camera module, the camera module comprising: a PCB (PrintedCircuit Board); an image sensor disposed on the PCB; the voice coilmotor of claim 1 disposed on the PCB; and a lens coupled with the bobbinof the voice coil motor.
 16. A mobile device, the mobile devicecomprising the camera module of claim
 15. 17. A VCM (Voice Coil Motor),comprising: a base; a cover member disposed on the base and comprisingan upper plate and a lateral plate extending from the upper plate; abobbin disposed in the cover member; a coil and a magnet disposed in thecover member and configured to move the bobbin in an optical axisdirection; a lower elastic member comprising an outer part disposed onan upper surface of the base, an inner part coupled to the bobbin and aconnection part connecting the outer part and the inner part; and aterminal disposed on the base, wherein the terminal is electricallyconnected to the outer part of the lower elastic member, wherein thebase comprises a groove formed on the upper surface of the base, whereinthe groove of the base is disposed at a position corresponding to atleast a portion of an end of the outer part of the lower elastic member,wherein the terminal is connected to the outer part of the lower elasticmember by a conductive member, and wherein the groove of the base isconfigured to accommodate at least a portion of the conductive member.18. The VCM of claim 17, wherein the groove of the base is recessed froman outer lateral surface of the base.
 19. The VCM of claim 17, whereinthe groove of the base is disposed adjacent to the conductive member.20. A VCM (Voice Coil Motor), comprising: a base; a cover memberdisposed on the base and comprising an upper plate and a lateral plateextending from the upper plate; a bobbin disposed in the cover member; acoil disposed on the bobbin; a magnet disposed between the coil and thelateral plate of the cover member; a lower elastic member comprising anouter part disposed on an upper surface of the base, an inner partcoupled to the bobbin and a connection part connecting the outer partand the inner part; and a terminal disposed on the base, wherein theterminal is electrically connected to the outer part of the lowerelastic member, wherein the base comprises a groove formed on the uppersurface of the base and opened outside, wherein the groove of the baseis disposed at a position corresponding to at least a portion of an endof the outer part of the lower elastic member, wherein the terminalcomprises a terminal end part more protruding than the outer part of thelower elastic member in an upward direction, and wherein the terminalend part is connected to the outer part of the lower elastic member by aconductive member.